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High Speed Dispenser Product List

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High-Speed Dispenser "CPD-1000"

High-speed dispenser achieving top-class coating speed in the industry.

The "High-Speed Dispenser CPD-1000" features a unique cast frame structure and axis control technology, along with vibration control technology, achieving low vibration even during high-speed X-Y movements in production, ensuring stable adhesive application. Additionally, it adopts a three-head system to accommodate diverse production needs. Each head is equipped with an independent servo motor configuration, allowing for individual adjustments of pressure, temperature, and operation during application, thus realizing high-speed and high-precision coating. There are also plenty of options available to meet various needs and achieve high-precision application. 【Features】 ■ Ultra-fast application Achieves industry-leading application speed (0.07 sec/shot) ■ High-precision application Continues stable high-precision application due to a highly reliable device structure ■ High flexibility Accommodates diverse application needs with a rich array of options *For more details, please download the PDF or feel free to contact us.

  • Press Dies
  • Other electronic parts
  • Other semiconductor manufacturing equipment
  • High Speed Dispenser

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The world's fastest high-speed dispenser "Quspa-SP" has arrived!

Super-efficient dispensing process. High-speed dispenser device 'Quspa-SP'.

With the spread of AI and high-performance devices, the efficiency of semiconductor production has become a challenge. A high-speed dispenser that contributes to productivity improvement will be launched in spring 2025. It achieves unprecedented coating speeds of up to 500 shots per second. While maintaining the high precision characteristic of the 'Quspa' series, it enables even faster application. Various new specifications are planned to be equipped, anticipating increased takt time in mass production. ■ Large substrates: Standard support ■ Equipped with a single-axis dual-head: Capable of applying two types of materials without replacement

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High-density packaging (narrow pitch packaging)

The implementation components can accommodate high density and close proximity from 0402 to CSP, BGA, and more.

We have introduced two FUJI-made 7-head placement machines, the 'NXT IIIc', among our nine assembly lines. This has improved our assembly speed and enabled us to achieve higher density circuit board assembly. We are producing various high-density circuit boards for PCs, smartphones, tablets, and more. We also welcome factory tours, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to inquire.

  • Surface treatment contract service
  • Contract manufacturing
  • Embedded system design service
  • High Speed Dispenser

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